Two new monolithic, very high voltage, off-line switching regulators
unveiled by Motorola today combine a powerful MOSFET, which drives the
transformer primary, on the same chip with the supply controller circuit.
This single chip solution makes possible a reduction in the overall component
count for power supplies, which reduces PC board area and total system
cost for power supplies - as well as lowers manufacturing placement and
inventory costs.
Employing a very high voltage SMARTMOS process, the two new off-line
switching regulators, types MC33363B and MC33365, are specifically designed
to operate from a rectified 240 or 120 Vac line source. They are highly
integrated for use in off-line AC-DC and high voltage DC-DC applications
such as office automation, consumer and industrial products.
The MC33363B features an on-chip 700 V/1.0A SENSEFETTM power switch,
a 450V active off-line startup FET, a duty cycle controlled oscillator,
a current limiting comparator with a programmable threshold and leading
edge blanking, latching pulse width modulator for double pulse suppression,
high gain error amplifier and a trimmed internal bandgap reference. Protective
features include cycle-by-cycle current limiting, input undervoltage lockout
with hysteresis, output overvoltage protection and thermal shutdown.
The MC33365 contains the same features except that the overvoltage protection
is replaced by a comparator to sense the line voltage of the bulk capacitor
and detect any brown-out condition (drop of AC line voltage).
"The MC33363B and MC33365 series give designers flexibility to
optimize their power supply solutions" commented Scott Delaney, Marketing
Director of Motorola's Semiconductor Components Group. "At the same
time, they will lead to smaller form factors for their designs.".
Because these devices are designed to require a minimum number of external
components, printed circuit board space is significantly reduced and the
need for a heatsink is eliminated. The surface mount heat tab power package
allows the designer to heatsink the ICs by using the PC board copper as
a heat dissipator.