TriQuint Semiconductor, Inc. introduced the TGA1071-EPU, 36 to 40 GHz,
pHEMT (pseudomorphic High Electron Mobility
Transistor)
MMIC Power Amplifier to support a variety of millimeter wave applications
including Medium Capacity (Short Haul) and High Capacity (Backbone) Point-to-Point
Digital Radio, and Point-to-Multipoint Digital Radio markets.
This IC provides sufficient small signal gain and output power in single
ended configuration over this millimeter wave frequency range for most
low and medium capacity digital radios. For higher output powers as required
by high capacity digital radios, multiple devices may be combined. The
IC operates at +5 Volts bias. Typical DC current consumption is 120 mA.
Performance
The TriQuint Semiconductor TGA1071-EPU is a monolithic power amplifier
which operates from 36 to 40 GHz. This two stage power amplifier is capable
of providing greater than 150 mW of output power at any frequency in its
specified millimeter wave band when biased at 5 Volts, 120 mA. Typical
small signal gain is 15dB. Typical reliability of the TGA1071-EPU when
operated at a device channel temperature of 140 C is greater than 2 million
hours Mean Time To Failure.
The TGA1071-EPU is a two stage amplifier with a pair of 300um gate width
input devices driving two 400um gate width output devices. The active devices
are realized using TriQuint's proven 0.25um gate length power pHEMT process.
The TGA1071-EPU is fabricated using TriQuint's 0.25 um T-Gate power
pHEMT process. This device offers standard biasing with minimal off-chip
components. Each device is 100% DC and RF tested on-wafer to ensure performance
compliance.
Applications
This amplifier's 150 mW output power over 36 to 40 GHz makes it an
ideal power amp solution for point-to-point and point-to-multipoint digital
radios at 38 GHz .
Package
The TGA1071-EPU is available in chip form. Physical size is 3.4 x 2.1
x 0.10 mm. Bond pad and backside metalization is gold plated for compatibility
with eutectic alloy attachment methods as well as with thermocompression
and thermosonic wire-bonding processes.
Support
Technical support is available along with data sheet, evaluation fixtures,
and application notes. The TGA1071 data
sheet is available on TriQuintęs website in pdf format.