Philips Semiconductors, a leading global supplier of radio frequency
(RF) semiconductors, announced availability of the SA3600,
a highly integrated low power RF front-end receiver IC. The SA3600 targets
the coming wave of dual-band, multi-mode digital cellular phones. According
to Dataquest, more than 95% of the cellular phones produced worldwide in
2001 will be digital, with the majority supporting dual-band operation.
The SA3600 low-voltage RF receiver front-end integrates 800 MHz cellular
and 1900 MHz PCS-band low noise amplifiers (LNAs) and down conversion mixers.
The on-chip local oscillator (LO) frequency doubler, input/output buffer
amplifiers, matching circuitry and control mode logic reduces external
glue components. "By integrating all the key RF functions in a single chip,
the SA3600 provides a complete dual-band receiver solution that saves board
space and design time," explained Craig Conkling, product marketing manager,
Business Line Cellular at Philips Semiconductors. "Cellular phones continue
to shrink in size and cost while maintaining the required performance at
low-voltage. The SA3600 helps designers meet these objectives."
The cellular-band LNA and mixer consume 10 mA from 2.7 volt supply.
The PCS-band LNA and mixer consume 14 mA, which is 35% less power than
the existing best-in-class gallium arsenide (GaAs) RF front-end ICs. This
power saving translates directly into greater standby time in mobile phones.
Excellent RF performance is achieved with Philips Semiconductors' advanced
QUBiC2 (20 GHz fT) BiCMOS process. At 881 MHz, the LNA and mixer,
with external interstage SAW filter, provide 24 dB of gain, 2.6 dB noise
figure, and -10.5 dBm input IP3. At 1960 MHz, the equivalent PCS line up
provides 22 dB of gain, 3.1 dB noise figure, and -10.4 dBm input IP3. The
SA3600 provides the gain, noise figure and linearity needed to meet the
receiver sensitivity and intermodulation requirements for TDMA (IS-136
and GSM) dual-band mobile phones.