Philips Semiconductors, a division of Royal Philips Electronics, introduced the first integrated power train solution for next generation CPU and other high-current DSP/ASIC Voltage Regulator (Module) [VR(M)] applications. The PIP201-12M allows customers to reduce costs, save space and meet the thermal requirements and power demands of next-generation CPU processors, such as the Intel® Pentium® 4 Northwood and AMD Athlon processors.

A single PIP201-12M integrates all power and driver functions required for a single-phase synchronous buck converter. Multi-phase architectures providing higher current capabilities are easily implemented by using one PIP201-12M for each phase. Compatible with industry standard single- and multiphase pulse width modulator (PWM) controllers, the PIP201-12M integrated power train solution from Philips Semiconductors eliminates many of the design issues associated with synchronous buck converters.

"The PIP201-12M is the industry's first economical VR(M) power train solution with performance that enables designers to remove costly output bulk capacitors by driving system switching frequencies up to 1 MHz," said Bob Gee, product marketing manager, business line Power Products, Philips Semiconductors. "With the PIP201-12M, Philips Semiconductors is leveraging its expertise in state of the art technologies to meet the ever-increasing demands placed on designers by power hungry microprocessors."

Philips Semiconductors has optimized the PIP201-12M by utilizing Amkor's MicroLeadFrame package, a near-chip-scale, plastic-encapsulated (CSP) package with a copper lead frame substrate. The package offers Amkor's ExposedPad technology as a thermal enhancement by having the die-attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PCB.

Philips Semiconductor, Tel : 503 439 6110

The PIP201-12M is an integrated part that takes the driver and FET functions of a synchronous buck converter and puts all 3 functions into one package. Why do you need to know about it? Because Intel and AMD are coming out with microprocessors that are operating at higher frequencies with higher current demand. Last year the current demand was approximately 40 A peak, but by the year 2005 the projection is for 100 A peak (Icc max). That taxes the components that supply the current to the microprocessor. Now add to that mix the decreasing board size and you have a very significant challenge.

The synchronous buck controller consists of a PWM controller and a control IC (FET driver with a logic circuit). Connecting to the control IC or the FET driver are the high-side and low-side FET or what are called the control and synchronous FET. With this discrete solution the operating switching frequency is limited due to the parasitics of the PCB traces, and the various packages.

The PIP201-12M is the first in a family of products from Philips and it targets the high-end PC systems, especially the Pentium IV Northwood, and the AMD Athlon. Philips integrated the driver and FET functions and put them into one package for a more efficient operation. This allows it to operate at a higher frequency than the discrete solutions. Typically, the Philips converter operates at 500 kHz but can operate at up to 1 MHz. A typical discrete solution operates at 250 kHz and needs 600 nH for the output inductor. Because the Philips converter can switch at 500 kHz, it can reduce the output inductor to 200 NH When you do that you can also reduce the decoupling capacitors by about 50% which helps save on the cost.

Everyone knows that motherboards on PCs are getting smaller. This means that DC/DC convertors have to supply more current in the same or smaller space. Therefore, engineers have to design for today's size or smaller, with higher frequencies and currents - and more heat. The maximum component temperature of the typical four-layer motherboards made from FR4 material is about 100 degrees C. Higher than that for an extended time will cause delaminating of the PC board. To help deal with these thermal issues Philips (and others to come) has introduced the PIP (Philips Intelligent Power) product family. They joined with Amkor and added the Amkor ExposedPad technology. The exposed pad technology helps draw heat out of the package and because it is thin it is able to dissipate heat off the top as well.

Philips is not the only one in this market space, but they picked their niche - PCs. Some other companies appeal to markets such as ASPs or networking that address space and form-factor of the pizza boxes in bays of servers. These markets are not as price aggressive as PCs. Obviously when addressing the PC market you must be more aggressive about the costs. The Philips solution at $3.50 each (quantities of 10,000) compared to about $13.00 each, is considerably more cost sensitive, for now, than other products.

The PIP201-12M is now available in samples worldwide, with volume production expected in December 2001. In the U.S., pricing for the PIP201-12M is $3.50 each in quantities of 10,000. Pricing in other countries is available on request.

Data sheets were not available on the Philips site at the time of this review. For more information and data sheet information please send an email to: bob.gee@philips.com.