Big things are happening in small packages and that is certainly
true for this product. This is not a me-too
product but one that extends the use of a capacitive
technology in a way no one had thought to use it. Designers
will want this product because it shrinks the board
space required, lessens the weight, and reduces the bill of materials.
This is not a bad trio of reasons for selecting a design.
The standard function of the Direct Access Arrangement (DAA)
begins at the Central Office (CO), which requires a
certain line termination such as an AC or DC impedance termination.
Additionally, at the CO you need a certain signal
level for dial tone or pulse dialing as well as a signal level
for transmitting information by voice. Typically, the
DAA supplies the line termination as well as some safety
functionality. For example, since the telephone line that runs
outside your house is subject to all kinds of events including
lightning surges it needs to be protected. The way thatęs
done is to divide the customer premises into a high-voltage and
low-voltage section. The usual method to isolate these
sections was with a transformer.
Silicon Labs figured out a way to isolate the high/low voltage
sections capacitively. They call the design ISOcap
technology. The Silicon Labs DAA design uses two chips. One chip
from the local side has a digital interface to the
DSP that goes through the ISOcap interface. The ISOcap provides
the capacitive isolation that is also a digital
communications link to an analog chip on the high-voltage side.
With the digital communications across the capacitive
link they can program the mixed signal chip on the high voltage
side with many line terminations. They also have a CODEC
on the high voltage side that allows the data to be digitized and
sent across the capacitor digitally.
The caps are lighter, cheaper and smaller, and have better densities
than transformers. Additionally, the transformer
to the phone line uses an analog design and that limits its
flexibility. So if you wanted to make a design for the US
and Europe you would have to use different boards because there
are different requirements for the terminations.
The Si3050 chipset includes the Si3050 and the Si3019. The 3050 is
the digital chip that sits on the low voltage side
and the 3019 is the mixed signal chip that sits on the high voltage
side. These chips are made in the standard 0.25-micron
CMOS process, not in high voltage CMOS. Although the mixed signal
chip is sitting on the high voltage side it doesnęt
see those voltages because it is isolated through the capacitive
barrier. There also is an external set of components
around that mixed signal chip to handle the higher signaling
voltages of the telephone line.
So what is the capacitive isolation technology? Simply put, it
isolates the customer premise equipment from the phone line.
Although the capacitive isolation technology isnęt new, what
Silicon Labs offers that is different is a chip set with a
split architecture. It uses the ISOcap capacitors to send digital
data to communicate between two chips that are physically
isolated. Then Silicon Labs does some unique things. First,
the 3050 that sits on the system side, doesnęt need a
power supply from the system because it has a 3.3V power supply. But
the mixed signal chip, the 3019, that sits on the phone
line interface, doesnęt have a power supply. Initially it is
powered by sending power across the capacitor to the 3019
chip. Once the phone goes off hook it uses a little bit of the
loop current supplied by the phone line to power the chip.
Thatęs pretty unique to allow that chip to be on the telephone
line but not require a power supply.
The chips have a DSP on them that have application software
written for the DAA. To meet the telephone line standards
the company uses programmable registers that alter the line
interface characteristics. SL looked at the telephone line
standards from around the world to determine the design bounds
for the line interface but also allowed them to be flexible
so any changes in standards can be met by manipulating some
registers via the customeręs software.
The 3050 provides PCM, GCI, and STI interfaces. There also are
16 built-in AC terminations that allow you to make slight
adjustments in case you need better matching. Older implementations
used a discrete DAA with a transformer that was country
specific. It required separate boards for different countries and
used a single multi channel CODEC depending on how many
channels you wanted to port. That solution was quite large and the
BOM was large for the international companies needing
to support different country requirements. For example, the board
area needed for one channel would be about 4 square
inches. The 3050/3019 only takes up about 1.5 square inches.
Other companies offer a non-transformer type solution but they
typically offer optical isolation. The optical couplers
are more expensive with more components. These solutions donęt
generallt save any board space compared to transformer
solutions. Additionally, optical couplers typically have a large
BOM depending on the requirements of the design. For
example, for PBXs you have a couple variations to go off-hook, one
is called ground start and the other is called loop
start. For some solutions it requires additional components to
implement a ground start compared to the integrated SL
solution, which has on-chip controls for either ground or loop start.
The Si3050 is a two-chip solution that includes a 20-lead TSSOP
system-side device and a 16-lead TSSOP line-side device.
Pricing for the chipset starts at $5.50 in quantities of 10,000.
Samples are available now and volume production will
begin in the third quarter of 2002. Evaluation boards are available
for $175.
Product brief:
http://www.silabs.com/pdfs/3050_PB.pdf