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PART
1: WHATıS IT ALL ABOUT?
by George
Martin
Start ı Narrowing
Specs ı Selecting the CPU ı Packaging
ı The Software ı Memory
ı Your Job ı Sources
and PDF
PACKAGING
Packaging is next. We probably need to
leave the through-hole world and enter the surface-mount arena for
the CPU and memory. The high pin counts of the available devices make
this a necessary shift.
But, in the surface-mount arena, there
are still several packaging density choices. Components with pads
at 0.050ı spacing (SOP, SOJ, PLCC) offer 0.010" line width and
0.010" line spacing, which allows one line between each pad.
Components with pads at 0.020" spacing (TSOP) require a 0.008"
line width and spacing. Then, you probably donıt want to put lines
between pads.
An IC-packaging technique (BGA) puts
solder balls in an array on the bottom of the chip. These solder balls
melt and bond to pads when the devices are heated to the proper temperature.
You have to inspect these bonds with x-ray equipment or at least x-ray
glasses.
If you donıt have the sophisticated equipment
in-house to assemble the surface-mount devices, you can find contract
manufacturers to provide these services.
For this design, letıs select 0.050"
packages and use 0.010" design rules.
DEVELOPMENT TOOLS
What are we going to use for development
tools? Iıd like to have an emulator. But, that causes two problems:
I donıt want to invest those kinds of dollars in capital equipment
(neither does your management) and most of the chips I mentioned donıt
have an emulator.
How is that possible? As devices have
been getting smaller and faster, the special chips that were used
as the basis of emulators were no longer practical. These special
chips were special faster devices with special emulator-only functions
available on the pins. Essentially, the manufacturers built these
and other support features into the later generations of CPUs.
And, if we use surface-mount technology
for manufacturing, then we wonıt be able to plug the emulator in and
out. So, todayıs devices have an emulator interface built in and/or
are so complete that you just need to provide power, clock, and memory
to load startup code.
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