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by Tom Cantrell
Start ı It's
a Small World ı Cosmic COTS Motes ı
That's Kode with a "K" ı Dust
Buster ı Down and Dirty ı Sources
and PDF
ITıS A SMALL WORLD
Enter the Berkeley Smart Dust crew. With
the requisite DARPA funding, they are getting down and dirty with
embedded. Actually, the Smart Dust project proper is suitably blue
sky, but more from a pragmatic than theoretical perspective (see Figure
1).
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(Click
here to enlarge)
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Figure 1ıThe Smart
Dust challenge is to integrate an entire self-powered, networked
smart sensor into one cubic millimeter. |
High-end research is struggling with
the best way to churn through mountains of data and miles of networks
with huge chips. By contrast, the Smart Dust challenge is to come
up with the tiniest gadget that can do something useful. Ultimately,
the goal of shrinking everything (processing, sensing, communication,
power) onto a single chip calls for fundamental advances that will
combine the capabilities of digital, analog, optical, MEMS, and so
forth in a single cubic millimeter.
Envisioned applications are no less like
science fiction. [1] Take, for example, the possibility of seeding
forests with a layer of dust to instantly detect and pinpoint the
start of a forest fire. Everything you own will have a tiny ID tag
thatıll scream over the radio if itıs stolen. A speck of dust on each
fingernail will turn any flat surface into a virtual keyboard. (And,
I know just what gesture Iım going to map to Ctrl + Alt + Delete.)
The good news is Iım quite sure the Smart
Dust folks will ultimately deliver breakthroughs in beyond-PC silicon
enabling all manner of yet unforeseen applications. The bad news,
at least until recently, was that there was little an average engineer
could do beyond attending a conference or reading a paper while, pardon
the pun, waiting for the dust to settle.
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Posted with permission.
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