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by Tom Cantrell
Start ı March
of Memory ı Protection Racket ı Sources
and PDF
Silicon Storage Technology (SST) may
not be a household name to most designers, however, chances are youıre
using the companyıs technology on a daily basis without even knowing
it.
Although SST makes chips like a regular
IC company, it also plays a major role as an OEM supplier of flash
memory process know-how. SSTıs split-gate thick-oxide NOR-type SuperFlash
technology is notable for simple manufacturing, using conventional
CMOS fab gear, which makes it a natural for flash memory-based SOCs
that combine memory with other digital functions.
SSTıs process OEMs are heavyweightsıincluding
IBM, Motorola, Samsung, Sanyo, Seiko, and super-foundry TSMC. In fact,
it looks like in the near future practically anyone buying a PC will
be contributing to the bottom line. SST recently announced it has
been licensed to supply flash memory chips compatible with the latest
Intel ı800 series chipset Firmware Hub protocol.
The SST process also serves as the foundation
for its own catalog of parts, including conventional flash memory
chips, CompactFlash cards, and so on. SST also offered a FlashFlex51
MCU for some time, but the novelty has worn off now that everyone
is jumping on the Flash-MCU bandwagon. No doubt, more than a few use
the SST process.
But this month, I want to take a look
at an SST part that caught my eye at the recent Embedded Systems Conference.
It combines flash memory and SRAM on the same chip (see Photo 1).
This concept isnıt new, but may be just now coming of age.
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| Photo 1ıThe new SST32VFxxx
ComboMemory chips combine 8 or 16 Mb of flash memory with 2
or 4 Mb of SRAM in a 48-lead ball grid array (BGA) package smaller
than a postage stamp. |
Actually, the latest SST32VFxxx
parts arenıt monolithic, but use separate SRAM and flash memory die
combined in a multi-chip package (MCP). Although it is a hybrid, thereıs
little to distinguish it from SSTıs earlier generation of monolithic
parts (SST31LFxxx). SST uses a straightforward yield-based
calculation to determine whether a hybrid or monolitihic implementation
is more cost-effective. As silicon marches on, yesterdayıs hybrid
will become tomorrowıs monolithic part, even as the next generation
of higher capacity hybrids are introduced.
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Posted with permission.
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