Industry

(Click here for older articles)

Memory Technology -- Industry Subsections

New Products

News

Resources

- Memory Technology (Top Page) -

New Products

Cypress announces production of the industryıs highest-density true dual-port communications RAM
Cypress Semiconductor announced production of its 9Mb Dual-Port RAM, the world's highest density true dual-port memory. The CY7C0853V is the latest addition to the broad portfolio of high-density dual-ports including the 4Mb, 2Mb and 1Mb devices currently in production. Cypress's true dual-port memories are specifically designed to address the memory buffering requirements of high-performance wireless basestations, storage networks and wide-area networks. (ChipCenter: WebScan)

News

- New - Philips to extend smart cards into new realm
Royal Philips Electronics has received certification through Visa International to extend the use of smart cards into a new realm that will combine banking, transportation, retail purchases, and other types of financial transactions. The company's dual-interface MIFARE PROX controller marks the first time a card technology that incorporates both a contact and contactless interface has received Visa's Level 3 security clearance. (Electronic Buyers' News)
- New - Toshiba charges Samsung with patent violations
Toshiba Corp. confirmed that it had filed suit against Samsung Electronics in the U.S. and Japan charging NAND flash memory and DRAM patent violations. A spokesman said Toshiba and Samsung previously had a cooperative agreement on NAND flash memory, which expired last year. The two companies were unable to settle on terms to renew the agreement, and the spokesman said Toshiba had no recourse but to file patent infringement suits against Samsung. (Electronic Buyers' News)
- New - Micron Technology announces signing a memorandum of understanding with Hynix Semiconductor for memory business
Micron Technology, Inc. (NYSE:MU), announced the signing of a non-binding memorandum of understanding for the purchase of Hynix's memory business in exchange for approximately 108.6 million shares of Micron common stock. Micron will also invest $200 million USD in Hynix in return for a 15% equity stake in Hynix's continuing non-memory businesses. (ChipCenter: WebScan)
- New - Nexsan chooses Cypress's Delta39K CPLD for next generation enterprise storage solution
Cypress Semiconductor announced the selection of Cypress's Delta39Kı CPLD by Nexsan Technologies for its new InfiniSANı ATAboy2ı storage solutions. The deterministic timing and abundant high-speed memory of Delta39K CPLDs are the key differentiators from other programmable logic solutions in the market that made Nexsan select these CPLDs. (ChipCenter: WebScan)
Jin Nyum's departure casts shadow on Hynix-Micron deal
Concerns about progress in the negotiations began with the resignation of Korea Exchange Bank president Kim Kyung-lim, followed by Deputy Premier and Finance and Economy Minister Jin Nyum, who quit to run for governor of the Kyonggi province. Jin has been the one consistent voice supporting the negotiations for the sale of Hynix's assets to Micron and his departure leaves the government wondering what course it should pursue. (e-inSITE)
Mosel-Vitelic files complaint against Hitachi and Elpida
Mosel-Vitelic of Taiwan filed a complaint at the U.S. International Trade Commission charging that Hitachi Ltd. and Elpdia Memory Inc. had infringed certain patents on DRAM and flash memory. The Taiwan chip maker also named the U.S. subsidiaries of the Japanese firms -- Hitachi Semiconductor America and Elpida Memory (USA)- in the complaint. (Electronic Buyers' News)
Unprecedented alliance created for breakthrough semiconductor R&D
The alliance joins together three of the world's leading industry players in semiconductor research and process development - STMicroelectronics, Motorola and Philips - and would include the participation for process development and alignment of the world's largest semiconductor foundry, TSMC. The joint development program will be based in Crolles, France, in the new R&D Center called 'Crolles2,' and augmented by each company's existing R&D operations and laboratories. (ChipCenter: WebScan)
DRAM makers resist cutting contract prices
A recent sharp drop in DRAM tags on the open market doesn't necessarily portend a corresponding drop in OEM contract pricing, according to memory suppliers that are eager to defend recent price hikes. (Electronic Buyers' News)
Intrinsix joins Virage Logic Memory Alliance Program
Intrinsix Corp., the largest independent ASIC and System (SoC) design company, today announced that it has joined the Virage Logic Corp. (Nasdaq: VIRL)Memory Alliance Program (MAP). Through this program Intrinsix becomes a certified design center and will be provided early access to Virage Logic memory technologies. (ChipCenter: WebScan)
Korean bank may offer $1.5B loan for Hynix deal
Korea Development Bank is considering a $1.5 billion loan to help creditors of Hynix Semiconductor Inc sell most of the memory chipmaker to Micron Technology Inc, a creditor said. The creditors hope to sell Hynix's memory operations and a slice of the non-memory operations for some $4 billion to U.S. rival Micron, creating the world's biggest memory chipmaker and reducing overcapacity that sent chip prices plummeting last year. (Electronic Buyers' News)

Resources

ChipCenter Reference Library
This is your access point for lots of good information covering applications, design tools, consultants, intellectual property, trade shows and standards.
Standards Watch
Here is your access point to the standards world.

Georgia Ann Beyersdorfer, Memory Technology consulting editor, has currently completed Suffolk University with a Bachelor of Science in Electrical Engineering.
Your comments are welcome!


		Click here to get your listing up.