New Second-Source Solutions Enable Greater Data Rate Range, Longer Transmission Distances Than Previous Devices
Dallas, Texas--Extending its leadership in serving wireless infrastructure requirements, Texas Instruments Incorporated (TI) announced a line of serializer-deserializer (SerDes) solutions designed to transmit data over high-speed backplanes using 25 percent less power than competitive devices. Designed as drop-in replacements for existing market solutions, the new 10:1/1:10 SerDes devices offer improved operating characteristics that permit a wider data rate, longer transmission distances, and easier design than previously available products. Among the applications that will benefit from these improved features are wireless base stations, data communications backplanes, video and industrial systems.
TI's SN65LVDS1023/1021 Serializer-Transmitters and SN65LVDS1224/1212 Deserializer-Receivers provide data throughput over low-voltage-differential signaling (LVDS) backplanes at rates from 100 to 660 Mbits/s. TI's SerDes products require less than 400 mW of power at 660 Mbits/s to convert 10-bit words into single-bit data streams, transmit the data over cable or copper backplane media, then receive and reconvert the data into 10-bit words again.
Featuring a flow-through pinout for ease of design, TI's new SerDes solutions provide a second-source drop-in replacement for existing products in the market. Unlike other devices, however, the TI solutions support a wider frequency range, from 10 to 66 MHz, enabling designers to achieve a wider range of data rates in the same system. An increase in voltage swing by 30 percent over competitive products supports greater backplane transmission distances. Improved jitter characteristics help simplify board design and save system costs.
More Channels, Less Space
"TI's new low-power LVDS SerDes products enable base station and other backplane customers to pack more channels into less space more cost-effectively than ever," said Atul Patel, High-Speed Communications and Controls Product Marketing Manager at TI. "Customers can come to TI for complete backplane solutions and system-level support that satisfy their design needs now and provide a roadmap for future development."
Other features of the LVDS SerDes devices include synch mode and lock indicators that facilitate design, verification, and troubleshooting.
Characterization for the industrial temperature range of -40 to 85°C makes the devices more widely useful in extreme environmental conditions. The CMOS process used in manufacturing the devices lowers costs and offers the potential for integration with other CMOS functions as market requirements develop.
The new low-power SerDes solutions complement TI's wide portfolio of SerDes products, supporting data rates up to 10 Gbits/s. Customers who design with the low-power devices have a range of SerDes solutions available from TI for future redesigns of their backplane products. Other high-performance TI solutions designed for use in wireless infrastructure include operational amplifiers, data converters, power management solutions, digital signal processors (DSPs), and application-specific integrated circuits (ASICs).
Availability, Packaging, and Pricing
TI's new SerDes solutions are available in a 28-pin shrink small outline package (SSOP). Planned pricing for all devices is $5.40 each in quantities of 1,000. Availability is scheduled as indicated in the table below.