To continue providing higher performance in ever smaller package sizes for high power applications, Toshiba America Electronic Components, Inc. (TAEC) today announced a new generation of thin flat package ("Slim TFP") power MOSFET packages that are 60 percent thinner and require 30 percent less board space than the industry standard D²PAK package. Toshiba Corp. (Toshiba) developed the new Slim TFP, which is ideal for high efficiency, high component density power designs including DC-to-DC conversion and automotive applications. The Slim TFP has a maximum board mounting area of 10.7 x 9.2 millimeters (mm) with a profile of just 1.7mm (max.), which is 45 percent smaller than Toshiba's previous generation TFP devices. Combining a very low thermal resistance with low On-resistance (R_on) ratings, the Slim TFP packages have high DC current handling capabilities, and are rated for power dissipations of up to 125 watts (W). The new packages have a four-pin structure that minimizes the effects of parasitic inductances while ensuring improved immunity to electrical noise. The first Toshiba MOSFETs to be manufactured in a Slim TFP package will include a 500 volt (V), 8 amp (A) device with an R_on of 850mΩ and a 500V, 5A device with an R_on of 1500m. These MOSFETs are well suited for the power conversion market. "The new Slim TFP MOSFET packages meet our customers' requirements to accommodate ever-shrinking board real estate with smaller, thinner, power-efficient devices," said Brach Cox, manager of business development for power products at TAEC. "Toshiba's continued innovation enables design engineers to choose the optimal package to meet their specific high power application." Toshiba plans to expand the Slim TFP line up to include higher current devices, up to 20Amps (ID) for high-speed10V drive applications. For each design program, a TAEC engineering team is assembled to help customers create the best design based on system-chip architecture tradeoffs, silicon technology, cell libraries, IP, EDA tools, design flows, test, packaging, quality assurance and other criteria. Depending on each customer's own resources and skills, TAEC engineers can work as expert consultants or provide access to TAEC's sophisticated design tools. TAEC can also deliver turnkey engineering services to facilitate a new or derivative design. The 2SK3627 and 2SK3626 MOSFETs in Slim TFP packaging are available now and currently in mass production.

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