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International Rectifier Introduces Cooler-Running High-Speed, Isolated Rectifier-IGBT Modules for Compact, High-Current Applications

The
manufacturer says...
Chipcenter's
Nasser Kutkut, Ph.D., says...

International Rectifier, IR® today introduces the MTP Switch family of isolated modules insulated with a ceramic aluminum nitride layer for improved junction-to-case thermal resistance. The insulation layer enables as much as seven times better thermal conductivity (cooling capability) than alumina substrates used in competing devices. The new 600V- and 1200V-rated modules combine high-speed IGBTs with optimized diodes to form single-package, space- and assembly-cost saving alternatives to discrete solutions. The new modules are designed for high current industrial power supplies used in high frequency arc welding machines and uninterruptible power supplies (UPS). "The MTP Switch family modules feature enhanced thermal characteristics to reduce size, and low connector inductance and resistance to improve high-speed operation, said Dr. Francesco Vallone, International Rectifier Product Marketing Manager. The 50MT060ULS is a fully-insulated low-side chopper module, made with an International Rectifier Ultrafast IGBT and a HEXFRED® diode with ultrasoft reverse recovery current. The 50MT060WH is a fully-insulated half-bridge module built with a pair of IR's WARP Speed(tm) IGBTs in parallel and a HEXFRED freewheeling diode with UltraSoft reverse recovery current characteristics. This double-IGBT layout enables efficient power dissipation and current sharing. Two additional MTP Switch modules are available, with 1200V ratings. The fully-insulated 20MT120UF full-bridge and the 40MT120UH half-bridge modules host 1200V-rated IGBTs. The 1200V devices can be directly connected to the DC bus in the majority of three-phase systems. The half-bridge module is available with on-board temperature monitoring.

Cooler is better. That is definitely the case for all power semiconductor devices. Operating power semiconductor devices at cooler temperatures will greatly enhance their reliability as well as allow for reduction in package size and board space. This is what prompted International Rectifier to offer its new MTP switch family in modules insulated with a ceramic aluminum nitride layer for lower junction-to-case thermal resistance. The thermal performance of ceramic aluminum nitride is more than seven times better the conventional alumina substrates used elsewhere. In addition to improvements in thermal performance, the new MTP series also features lower connector parasitics (inductances and resistances) for improved high frequency switching performance.

Press Release


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