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  Wireless

    Product Review Archive

Products 1-99 Products 100-199

Date Product
04/09/03 Agere Systems to Provide Industry's Most Integrated, Cost-Effective Chip Set Enabling Seamless 802.11 Wireless Connections
04/09/03 Motorola i.Smart Reference Design Jump-Starts Smartphone Development
03/24/03 Marvell Announces 802.11g 54 Mbits/s Wireless LAN Solutions Featuring Flexible Architecture for Adaptation to IEEE 802.11g Standard
03/24/03 TI Is First To Include Hardware Security Features in Latest Generation of GSM/GPRS Chip Sets to Provide Added Protection and Privacy for Wireless Devices
03/17/03 Neah Power Systems Unveils Patent-Pending Silicon-Based Design for Micro Fuel Cells
02/24/03 Kopin Presents Results of a New High-Efficiency, Low-Voltage Transistor for Wireless Market
02/24/03 Five New OMAP Processors from TI Increase Wireless Application Performance as Much as 8x and Extend Battery Life of Handsets
02/06/03 TI Introduces Industry's Most Integrated UMTS Chipset and Reference Design for Small, Sleek 3G Mobile Devices
02/06/03 RF Solutions Introduces the WLAN Industry's Most Efficient, Low-Cost Power Amplifier for 802.11b/g Applications - the Multimode RFS P2023
02/06/03 Toshiba Single Chip Bluetooth Solution Integrates RF, Baseband and Mask ROM Circuits
01/22/03 1W CMOS Power Amplifier In Space Saving Mini SO-8 Package Provides Excellent Sound Quality in Portable Audio Applications
01/22/03 SiGe Semiconductor's New RangeCharger Power Amp Improves Output Power for Higher Stability, Transmission Range of 2.4GHz WLAN Systems
01/22/03 Oki Semiconductor Unveils Industry's Lowest Cost Bluetooth™ Bundled Evaluation Offering
01/06/03 Spirea Ab Announces Cost Optimized Transceivers For The 2.4GHz WLAN Market
01/06/03 New High Frequency Dual Serial Input PLL Synthesizers from Fujitsu Microelectronics Provide Ultra Low Supply Current, Industry's Smallest Package
12/12/02 Agere Systems Demonstrates First 162 Mbits/s High-Speed Wireless Networking Chip
12/12/02 MediaQ Launches Multimedia Platform Controller for Mass Market PDAs and Wireless Handsets
11/25/02 Breakthrough IEEE 802.11a/b/g Solution from TI Simplifies Wi-Fi Connectivity to any WLAN
11/25/02 Cypress Samples WirelessUSBı a 2.4 GHz Solution Offers High-Speed Wireless Connectivity for Keyboards, Mice and Gaming Consoles
10/31/02 Spirea AB Begins Sampling TripleTraC, The World's First Fully Integrated Multi-Standard Wlan Transceiver
10/31/02 Etenna's New Tri-Band Bluetooth, 802.11a/b Antenna Increases Flexibility, Efficiency in Wireless Device Design
10/18/02 Analog Devices' New Integrated Converter Solutions Reduce Design Costs For Next-Generation Wireless Infrastructures
10/18/02 Atsana Licenses ARM Core to Deliver its High-performance Wireless Multimedia Processor
10/02/02 SiGe Semiconductor Delivers Benchmark Levels of Power and Integration with New GPS Receiver IC for Automotive Vehicle Location and Portable Navigation Equipment
10/02/02 Analog Devices Unveils Industry's Flexible, High-Performance Integrated Synthesizer for Wireless Base Stations
09/06/02 Agilent Technologies Introduces Industry's First STC Infrared Transceiver for Next-Generation Ultra-Slim Cellular Handsets and PDAs
09/06/02 Silicon Laboratories Introduces The Aero+™ Transceiver With Integrated DCXO
08/22/02 Marvell Drives Mass Deployment of Wireless LANs With the Industry's First Two-Chip 802.11b Solutions
08/22/02 E-tenna Unveils ClearLink 2400 Antenna, Reducing Size, Cost and Design Cycle of Bluetooth, Wi-Fi Devices
08/08/02 Mindspeed Launches Miro -- Communications Convergence Processor that Bridges Wireless And Wireline Networks For Voice Transport
08/08/02 BrightCom Introduces Worldıs First Bluetooth Chip With Embedded Ethernet MAC
08/08/02 RF Modules Implement Turnkey Wireless Data Collection
08/08/02 IDT and Jungo Provide Development Platform for Wireless LAN and SOHO Routers
07/02/02 Toshiba Drop-In Solution for W-CDMA Infrastructure is a 3W S-Band MMIC
07/02/02 New TI Single-Chip Bluetooth Solution Uses Advanced Digital RF for Power Savings, Board Space Reductions and Lowest Cost
06/18/02 HIIPA Module and E-mode GaAs Technologies Combine to Create Innovative 50-Ohm Power Amplifier for GSM/GPRS Handsets

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