STANDARDS WATCH

December 15,1998

Find--and purchase online--the standards document you need from a comprehensive collection that includes IEEE, IEC, IPC, ISO and more. Searches may be conducted by keyword or document number. Other features of our standards pages include Hot Topics, where you can find the most recently published standards, and a glossary of standards acroynms.

Check here for news on proposed standards from IEEE, IEC etc. and ad hoc industry groups. If you have a standard you'd like us to watch, email Len Coleman (lcoleman@cmp.com).

IBM to jump into standards fray for Java (New York, December 15, 1998) ı The next phase in the fight for control of Java will begin before Christmas, when Sun Microsystems Inc. and IBM Corp. are expected to jointly issue an industrywide call asking all comers for input to an emerging spec of real-time Java extensions, EE Times has learned.

3G standard debate heats up (Sweden, December 15, 1998) ı As standard-setting deadlines for third-generation (3G) mobile communications approach, the pressure is on the companies and standards bodies seeking to define the future of the cellular phone. Recently, there have been some strategic moves from several key players but still no resolution of a stalemate on the licensing of intellectual-property rights for a key technology: wideband code-division multiple-access (CDMA) wireless communications.

Many of the standards listed below are available for purchase online, and links are included.

ANSI/IEEE C63.5-1998
TITLE: --American National Standard for Electromagnetic Compatibility - Radiated Emission Measurements in Electromagnetic Interference (EMI) Control - Calibration of Antennas (9kHz to 40 GHz)
DESCRIPTION:
Methods for determining antenna factors of antennas used for radiated emission measurements of electromagnetic interference (EMI) from 9kHz to 40 GHz are provided. Antennas included are linearly polarized antennas such as loops, rods (monopoles), tuned dipoles, biconical dipoles, log-periodic dipole arrays, broadband horns, etc. which are used in measurements governed by ANSI C63.4. The methods include standard site (i.e. 3-antenna), reference antenna, equivalent capacitance substitution, standard transmitting loop, standard atnenna, and standard field methods. ANSI/IEEE C63.5-1998

ANSI/IEEE C63.14-1998
TITLE: American National Standard Dictionary for Technologies of Electromagnetic Compatibility (EMC), Electromagnetic Pulse (EMP), and Electrostatic Discharge (ESD)
DESCRIPTION:
Covers terms associated with electromagnetic compatibility (EMC), electromagnetic pulse (EMP), and electrostatic discharge (ESD). Provides quantities, units, multiplying factors, symbols, abbreviations. ANSI/IEEE C63.14-1998

IEC PAS 62085 December, 1998
TITLE: --Implementation of Ball Grid Array and Other High Density Technology
DESCRIPTION:
Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments. IEC PAS 62085

IEC PAS 62084 --December, 1998
TITLE: Implementation of Flip Chip and Chip Scale Technology
DESCRIPTION:
Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier. IEC PAS 62085

IEEE 771-1998
TITLE: --IEEE Guide to the Use of the ATLAS Specification
DESCRIPTION:
Guidance in the use of ATLAS test language is provided. ATLAS may be used to describe test requirements independent of any specific test equipment, and examples of best practice in the use of ATLAS are given. IEEE 771-1998

IEC 61508-4 --December, 1998
TITLE: Functional Safety of Electrical/Electronic/Programmable Electronic Safety-Related Systems - Part 4: Definitions and Abbreviations
DESCRIPTION:
Contains the definitions and explanation of terms that are used in parts 1 to 7 of this standard. Intended for use by technical committees in the preparatoin of standards in accordance with the principles contained in IEC Guide 104 and ISO/IEC Guide 51. IEC 61508 is also intended as a stand-alone standard. IEC 61508-4

IEC 61508-5 --December, 1998
TITLE: Functional Safety of Electrical/Electronic/Programmable Electronic Safety-Related Systems - Part 5: Examples of Methods for the Determination of Safety Integrity Levels
DESCRIPTION:
Provides information on the underlying concepts of risk and the relationship of risk to safety integrity; a number of methods that will enable the safety integrity levels for the E/E/PE safety-related systems, other technology safety-related systems and external risk reduction facilities to be determined. Intended for use by technical committees in the preparatoin of standards in accordance with the principles contained in IEC Guide 104 and ISO/IEC Guide 51. IEC 61508 is also intended as a stand-alone standard.
IEC 61508-5

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