Previously Published Standards Articles

February 1999

01-FEB-99, IEC 62040-2
TITLE: Uninterruptible Power Systems (UPS) - Part 2
DESCRIPTION: Electromagnetic Compatibility (EMC) Requirement
Applies to single UPS units or UPS systems comprising a number of interconnected UPS and associated control/switchgear forming a single power system, intended to be installed in any operator accessible area or in separated electrical locations, connected to either industrial or public low voltage supply networks. This product EMC standard takes precedence over all aspects of the generic standards, and no additional testing is necessary. IEC 62040-2

01-FEB-99, IEC 60770-1
TITLE: Transmitters for Use in Industrial-Process Control Systems - Part 1
DESCRIPTION: Methods for Performance Evaluation IEC 60770-1

01-FEB-99, IEC 61803
TITLE: Determination of Power Losses in High-Voltage Direct Current (HVDC) Converter Stations
DESCRIPTION: Presents a set of standard procedures for determining the total losses of an HVDC converter station. IEC 61803

01-FEB-99, IEC 62019
TITLE: Electrical Accessories - Circuit-Breakers and Similar Equipment for Household Use
- Auxiliary Contact Units IEC 62019

01-FEB-99, IEC 60309-1
TITLE: Plugs, Socket-Outlets and Couplers for Industrial Purposes - Part 1: General Requirements
DESCRIPTION: Applies to plugs and socket-outlets, cable couplers and appliance couplers, with a rated operating voltage not exceeding 690 V d.c. or a.c, 500 Hz a.c. and a rated current not exceeding 250 A, primarily intended for industrial use, either indoors or out. IEC 60309-1

01-FEB-99, IEC 61249-2-13
DESCRIPTION: Materials for printed boards and other interconnecting structures - Part 2: Sectional specification set for reinforced base materials, clad and unclad
-
Section 13: Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
DESCRIPTION:Gives requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0.05 mm up to 6.4 mm. IEC 61249-2-13

01-FEB-99, IEC/TS 61340-5-2
TITLE: Electrostatics - Part 5: Protection of electronic devices from electrostatic phenomena - Section 2: User guide IEC/TS 61340-5-2

01-FEB-99, IEC 61000-4-14
TITLE: Electromagnetic compatibility (EMC) - Part 4: Testing and measurement techniques - Section 14: Voltage fluctuation immunity test
DESCRIPTION: Considers immunity tests for electrical and/or electronic equipment in their electromagnetic environment. Only conducted phenomena are considered including tests for equipment connected to public and industrial power supply networks. Establishes a reference for evaluating the immunity of equipment when subjected to positive and negative low amplitude voltage fluctuation (excluding flicker, a physiological phenomenon due to lighting luminance fluctuations). Has the status of a Basic EMC publication. IEC 61000-4-14

01-FEB-99, IEC 60079-11
TITLE: Electrical Apparatus for Explosive Gas Atmospheres - Part 11: Intrinsic Safety "i"
DESCRIPTION: Gives requirements for the design, construction, testing, and marking of electrical apparatus and electrical systems with type of protection 'i'. Also gives requirements for associated apparatus that is not protected for use within an explosive gas atmosphere but contains both intrinsically-safe circuits and non-intrinsically-safe circuits that can affect the safety of intrinsically-safe circuits. IEC 60079-11

01-FEB-99, IEC 61114-1
TITLE: Receiving antennas for satellite broadcast transmissions in the 11/12 GHz band - Part 1: Electrical measurements
DESCRIPTION: Defines the conditions and methods of measurements to be applied. Does not specify performance requirements. IEC 61114-1

01-FEB-99, IEC 61400-1
TITLE: Wind Turbine Generator Systems - Part 1: Safety Requirements
DESCRIPTION: Deals with safety aspects, quality assurance and engineering integrity, and specifies safety requirements for design, installation and operation of wind turbine generator systems. IEC 61400-1

01-FEB-99, IEC 61892-3
TITLE: Mobile and fixed offshore units - Electrical installations - Part 3: Equipment
DESCRIPTION: Contains provisions for electrical equipment in electrical installations of mobile and fixed units, including pipelines, pumping or "pigging" stations, compressor stations and exposed location single-buoy moorings, used in the offshore petroleum industry for drilling, production, processing and for storage purposes. IEC 61892-3

December 1998

08-DEC-98, IEEE 1413-1998
TITLE: IEEE Standard Methodology for Reliability
DESCRIPTION:
Prediction and Assessment for Electronic Systems and Equipment The framework for the reliability prediction process for electronic systems and equipment, including hardware and software predictions at all levels, is covered. IEEE 1413-1998

08-DEC-98, IEEE 1220-1998
TITLE: IEEE Standard for Application and Management of the Systems Engineering Process
DESCRIPTION: The interdisciplinary tasks, which are required throughout a system's life cycle to transform customer needs, requirements, and constraints into a system solution, are defined. In addition, the requirements for the system engineering process and its application throughout the product life cycle are specified. The focus of this standard is on engineering activities necessary to guide product develpoment while ensuring that the product is properly designed to make it affordable to produce, own, operate, maintain, and eventually to dispose of, without undue risk to health or the environment. IEEE 1220-1998

08-DEC-98, IEEE 1029.1-1998
TITLE: IEEE Standard for VHDL Waveform and Vector Exchange (WAVES) to Support Design and Test Verification
DESCRIPTION: The Waveform and Vector Exchange Specification (WAVES) is an application of the VHSIC Hardware Description Language (VHDL). This standard covers the dataset structure, header file, WAVES files, external files, execution model, and waveform semantics, and defines three standard packages to support WAVES datasets. IEEE 1029.1-1998

ANSI/IEEE C63.5-1998
TITLE: --American National Standard for Electromagnetic Compatibility - Radiated Emission Measurements in Electromagnetic Interference (EMI) Control - Calibration of Antennas (9kHz to 40 GHz)
DESCRIPTION:
Methods for determining antenna factors of antennas used for radiated emission measurements of electromagnetic interference (EMI) from 9kHz to 40 GHz are provided. Antennas included are linearly polarized antennas such as loops, rods (monopoles), tuned dipoles, biconical dipoles, log-periodic dipole arrays, broadband horns, etc. which are used in measurements governed by ANSI C63.4. The methods include standard site (i.e. 3-antenna), reference antenna, equivalent capacitance substitution, standard transmitting loop, standard atnenna, and standard field methods. ANSI/IEEE C63.5-1998

ANSI/IEEE C63.14-1998
TITLE: American National Standard Dictionary for Technologies of Electromagnetic Compatibility (EMC), Electromagnetic Pulse (EMP), and Electrostatic Discharge (ESD)
DESCRIPTION:
Covers terms associated with electromagnetic compatibility (EMC), electromagnetic pulse (EMP), and electrostatic discharge (ESD). Provides quantities, units, multiplying factors, symbols, abbreviations. ANSI/IEEE C63.14-1998

IEC PAS 62085 December, 1998
TITLE: --Implementation of Ball Grid Array and Other High Density Technology
DESCRIPTION:
Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments. IEC PAS 62085

IEC PAS 62084 --December, 1998
TITLE: Implementation of Flip Chip and Chip Scale Technology
DESCRIPTION:
Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier. IEC PAS 62084

IEEE 771-1998
TITLE: --IEEE Guide to the Use of the ATLAS Specification
DESCRIPTION:
Guidance in the use of ATLAS test language is provided. ATLAS may be used to describe test requirements independent of any specific test equipment, and examples of best practice in the use of ATLAS are given. IEEE 771-1998

IEC 61508-4 --December, 1998
TITLE: Functional Safety of Electrical/Electronic/Programmable Electronic Safety-Related Systems - Part 4: Definitions and Abbreviations
DESCRIPTION:
Contains the definitions and explanation of terms that are used in parts 1 to 7 of this standard. Intended for use by technical committees in the preparatoin of standards in accordance with the principles contained in IEC Guide 104 and ISO/IEC Guide 51. IEC 61508 is also intended as a stand-alone standard. IEC 61508-4

IEC 61508-5 --December, 1998
TITLE: Functional Safety of Electrical/Electronic/Programmable Electronic Safety-Related Systems - Part 5: Examples of Methods for the Determination of Safety Integrity Levels
DESCRIPTION:
Provides information on the underlying concepts of risk and the relationship of risk to safety integrity; a number of methods that will enable the safety integrity levels for the E/E/PE safety-related systems, other technology safety-related systems and external risk reduction facilities to be determined. Intended for use by technical committees in the preparatoin of standards in accordance with the principles contained in IEC Guide 104 and ISO/IEC Guide 51. IEC 61508 is also intended as a stand-alone standard.
IEC 61508-5

IEEE Standards for the Year 2000
The IEEE has published its standard for software quality assurance plans. Intended for use by people developing and maintaining critical software, the document provides uniform, minimum acceptable requirements for the preparation and content of Software Quality Assurance Plans SQAPs (IEEE 730-1998).

The IEEE has also addressed terminology including concepts, definitions, remediation techniques, and it highlights key topics for solving problems raised by Y2K (IEEE 2000.1-1998).

Design Automation
Virtual Sockets Interface (VSI)
The VSI Architecture and Overview Documents are now available for a 60-day member review, ending December 27, 1998. The Manufacturing Related Test 1 1.0 and the Implementation/Verification Specification 1 2.0 are now posted for a 60-day member review, ending December 20, 1998.
October 7, 1998 VSI Expands Standards Mission (EE Times article)

VHDL - Analog and Mixed-Signal Extensions (IEEE P1076.1)
For procedural -- not technical -- reasons, P1076 was disapproved as a standard at the Sept. 14, 1998 meeting of the IEEE RevCom Committee. RevCom objections including a question about a patent claim by Analogy and questions about the balloting process. The committee intends to resolve the issues and will attempt to resubmit the draft standard to RevCon at its Dec. 7, 1998 meeting.

Embedded Systems
Embedded Processor Debug Interface (Nexus)
A beta specification has been released - members can provide web feedback until Dec.15, 1998.
This ad hoc group's mission is to quickly define a global, open embedded processor development interface standard for all embedded controller applications.

Communications
Wireless Communication for Wearable Computer Devices (IEEE P802.11)
The IEEE 802.11-1997 standard is available. On Oct. 10, 1998, new state diagrams became available for to committee members only.
March 12, 1998 News release announcing working group's formation

Storage Systems
IEEE Storage Systems Standards Working Group
The SSSWG works to model generic mass storage systems, and based on such a model, to develop widely accepted standards which are readily implemented.
The current schedule is to finish drafts at the November1998 meeting. Balloting is scheduled for December and January and drafts will be submitted to IEEE on or before February 9th, 1999.

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